20 190

Cited 0 times in

Thermophysical properties and bonding with composite resin of premixed mineral trioxide aggregate for use as base material

Authors
 Min-Yong Lee  ;  Hi-Won Yoon  ;  Min-Jae Lee  ;  Kwang-Mahn Kim  ;  Jae-Sung Kwon 
Citation
 DENTAL MATERIALS JOURNAL, Vol.43(1) : 58-66, 2024-02 
Journal Title
DENTAL MATERIALS JOURNAL
ISSN
 0287-4547 
Issue Date
2024-02
MeSH
Acid Etching, Dental ; Aluminum Compounds* ; Calcium Compounds* ; Composite Resins* / chemistry ; Dental Bonding* ; Drug Combinations ; Materials Testing ; Oxides* ; Phosphoric Acids* ; Resin Cements / chemistry ; Shear Strength ; Silicates* ; Surface Properties
Keywords
37% phosphoric acid etching ; Dental base ; Premixed mineral trioxide aggregate ; Thermophysical property ; Tricalcium silicate
Abstract
Dental bases require low thermal conductivity and good mechanical properties, such as bonding with composite resins. This study aims to elucidate the physicochemical properties of premixed mineral trioxide aggregate (MTA) for its suitability as a dental base and to explore the optimal adhesive strategy with composite resin. The thermal conductivity and compressive strength of this premixed MTA are 0.12 W/(m•K) and 93.76 MPa, respectively, Which are deemed adequate for its application as dental base. When bonded to composite resin, the use of 37% phosphoric acid etching before applying the Clearfil SE bond significantly reduced the bonding strength between composite resin and premixed MTA. This was because the compressive strength and Vickers hardness of premixed MTA decreased, and tricalcium silicate was dissolved from the surface during acid etching. Therefore, it is recommended to avoid using 37% phosphoric acid etching when bonding premixed MTA and composite resin as a dental base.
Files in This Item:
T202402380.pdf Download
DOI
10.4012/dmj.2023-163
Appears in Collections:
2. College of Dentistry (치과대학) > Dept. of Dental Biomaterials and Bioengineering (치과생체재료공학교실) > 1. Journal Papers
Yonsei Authors
Kwon, Jae-Sung(권재성) ORCID logo https://orcid.org/0000-0001-9803-7730
Kim, Kwang Mahn(김광만) ORCID logo https://orcid.org/0000-0002-5235-0294
URI
https://ir.ymlib.yonsei.ac.kr/handle/22282913/199110
사서에게 알리기
  feedback

qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

Browse

Links