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Physical, Chemical, Mechanical, and Biological Properties of Four Different Commercial Root-End Filling Materials: A Comparative Study

Authors
 Tae-Yun Kang  ;  Ji-Won Choi  ;  Kyoung-Jin Seo  ;  Kwang-Mahn Kim  ;  Jae-Sung Kwon 
Citation
 MATERIALS, Vol.14(7) : 1693, 2021-04 
Journal Title
 MATERIALS 
Issue Date
2021-04
Keywords
endodontic materials ; mineral trioxide aggregate (MTA) ; retrograde filling materials ; root-end filling materials
Abstract
Commercial mineral trioxide aggregate (MTA) materials such as Endocem MTA (EC), Dia-Root Bio MTA (DR), RetroMTA (RM), and ProRoot MTA (PR) are increasingly used as root-end filling materials. The aim of this study was to assess and compare the physicochemical and mechanical properties and cytotoxicity of these MTAs. The film thicknesses of EC and DR were considerably less than that of PR; however, RM's film thickness was greater than that of PR. In addition, the setting times of EC, DR, and RM were shorter than that of PR (p < 0.05). The solubility was not significantly different among all groups. The three relatively new MTA groups (EC, DR, and RM) exhibited a significant difference in pH variation and calcium ion release relative to the PR group (p < 0.05). The radiopacity of the three new MTAs was considerably less than that of PR. The mechanical strength of RM was not significantly different from that of PR (p > 0.05); however, the EC and DR groups were not as strong as PR (p < 0.05). All MTA groups revealed cytocompatibility. In conclusion, the results of this study confirmed that EC, RM, DR, and PR exhibit clinically acceptable physicochemical and mechanical properties and cell cytotoxicity.
Files in This Item:
T202101464.pdf Download
DOI
10.3390/ma14071693
Appears in Collections:
2. College of Dentistry (치과대학) > Dept. of Dental Biomaterials and Bioengineering (치과생체재료공학교실) > 1. Journal Papers
Yonsei Authors
Kwon, Jae-Sung(권재성) ORCID logo https://orcid.org/0000-0001-9803-7730
Kim, Kwang Mahn(김광만) ORCID logo https://orcid.org/0000-0002-5235-0294
URI
https://ir.ymlib.yonsei.ac.kr/handle/22282913/182861
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