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D-band heterodyne integrated imager in a 65-nm CMOS technology

DC Field Value Language
dc.contributor.author오승재-
dc.date.accessioned2016-02-04T11:08:25Z-
dc.date.available2016-02-04T11:08:25Z-
dc.date.issued2015-
dc.identifier.issn1531-1309-
dc.identifier.urihttps://ir.ymlib.yonsei.ac.kr/handle/22282913/139754-
dc.description.abstractA D-band heterodyne integrated imager, consisting of a mixer, an oscillator, an IF amplifier, and an IF detector, has been developed in a 65-nm CMOS technology. A measured responsivity of 720 kV/W and noise equivalent power (NEP) of 0.9pW/Hz were obtained at 125 GHz. A total dc power of 74 mW was dissipated. The chip size 1200 * 800 is including contact pads and an input balun. A D-band image was acquired with the imager serving as a detector. A significant resolution enhancement was demonstrated with a near-field imaging achieved by a metal plate with a pinhole in the imaging setup.-
dc.description.statementOfResponsibilityopen-
dc.relation.isPartOfIEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS-
dc.rightsCC BY-NC-ND 2.0 KR-
dc.rights.urihttps://creativecommons.org/licenses/by-nc-nd/2.0/kr/-
dc.titleD-band heterodyne integrated imager in a 65-nm CMOS technology-
dc.typeArticle-
dc.contributor.collegeResearcher Institutes (부설 연구소)-
dc.contributor.departmentInstitute for Medical Convergence (연의-생공연 메디컬융합연구소)-
dc.contributor.googleauthorDaekeun Yoon-
dc.contributor.googleauthorNamhyung Kim-
dc.contributor.googleauthorKiryong Song-
dc.contributor.googleauthorJungsoo Kim-
dc.contributor.googleauthorSeung Jae Oh-
dc.contributor.googleauthorJae-Sung Rieh-
dc.identifier.doi10.1109/LMWC.2015.2390496-
dc.admin.authorfalse-
dc.admin.mappingfalse-
dc.contributor.localIdA02383-
dc.relation.journalcodeJ01020-
dc.identifier.urlhttps://ieeexplore.ieee.org/document/7017460-
dc.subject.keywordCMOS-
dc.subject.keywordCMOS integrated circuit-
dc.subject.keywordimaging-
dc.subject.keywordreceivers-
dc.contributor.alternativeNameOh, Seung Jae-
dc.contributor.affiliatedAuthorOh, Seung Jae-
dc.rights.accessRightsnot free-
dc.citation.volume25-
dc.citation.number3-
dc.citation.startPage196-
dc.citation.endPage198-
dc.identifier.bibliographicCitationIEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, Vol.25(3) : 196-198, 2015-
dc.identifier.rimsid52995-
dc.type.rimsART-
Appears in Collections:
1. College of Medicine (의과대학) > Research Institute (부설연구소) > 1. Journal Papers

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