4. SEM 관찰시 전기화학적 식각에 비해 Silicoating은 gap이 없는 금속-레진 계면이 관찰되었다.
5. EPMA 관찰시 Silicoating은 전기화학적 식각보다 금속 - 레진 계면과 레진 세멘트부위에서 Si원소가 집중되어 나타났다.
6. 2배 확대 관찰시 Silicoating은 주로cohesive failure를, 전기화학적 식각처리시에는 adhesive failure를 보였다.
[영문]
This study investigated the effects of Silicoating procedure on the tensile bond strength of resin-bonded prostheses.
The Rexillium Ⅲ specimens were treated with electrochemical etching and Silicoating procedure, followed by thermocycling and the NNB, Pors-on 4, and Degudent-U specimens were treated with Silicoating procedure.
The specimens were debonded in tension with a Tensilon machine. Also, all specimens were observed with SEM, concentration of Si, elements was analysed with EPMA, and the mode of failure was recorded.
The results of this study were obtained as follows:
1. In the Rexillium Ⅲ specimens, the tensile bond strength of the Silicoated specimens was higher than that of the electrochemically etched specimens, and significant differences were observed (P< 0.05).
2. The tensile bond strength of electrochemically etched Rexillium Ⅲ specimens, significant differences were observed between the thermocycled and nonthermocycled specimens (P<0.05), but no significant differences were observed in the Silicoated
specimens (P> 0.05).
3. The tensile bond strength of the Silicoated specimens decreased NNB, Pors -on 4, Rexillium Ⅲ, and Degudent-U in that order named.
4. Unlike the electrochemically etched specimens, the Siliceated specimens stowed gap-free metal-resin interfaces with SEM.
5. Compared to the electrochemically etched specimens, the Silicoated specimens showed higher concentration of Si elements at the metal-resin interfaces and resin cement.
6. Photographic evaluation (Χ2) of the fractured sites revealed mainly cohesive failures with the Silicoated specimens, and adhesive failures with the electrochemically etched specimens.