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Applying material optimization to fracture mechanics analysis to improve the reliability of the plastic IC package in reflow soldering process

Authors
 Geun Woo Kim  ;  Kang Yong Lee 
Citation
 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES , Vol.29(1) : 47-53, 2006 
Journal Title
 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 
ISSN
 1521-3331 
Issue Date
2006
Abstract
To prevent crack propagation in a plastic small outline J-lead package with a dimpled diepad under an IR soldering process, parametric study and optimization with respect to material properties are done. The main design variables among all material properties are determined from the parametric study. Their optimized values are determined by applying a constraint optimization technique to the IC package.
Full Text
http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=1599492
DOI
10.1109/TCAPT.2006
Appears in Collections:
2. College of Dentistry (치과대학) > Dept. of Prosthodontics (보철과학교실) > 1. Journal Papers
Yonsei Authors
Lee, Keun Woo(이근우) ORCID logo https://orcid.org/0000-0002-3153-190X
URI
https://ir.ymlib.yonsei.ac.kr/handle/22282913/110964
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