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Tensile bond strength between elastomeric impression materials and tray resins depending on the thickness of the tray adhesive

Authors
 Kim Tae-Won  ;  Lee Keun-Woo  ;  Jeong Mun-Gyu  ;  Moon Hong-Suk 
Citation
 Journal of Korean Academy of Prosthodontics (대한치과보철학회지), Vol.44(6) : 699-711, 2006 
Journal Title
 Journal of Korean Academy of Prosthodontics (대한치과보철학회지) 
ISSN
 0301-2875 
Issue Date
2006
Keywords
Tray adhesive ; Tensile bond strength ; Elastomeric impression material
Abstract
Statement of problem: Elastomeric impression materials have been widely used to obtain an accurate impression. However there have not been enough studies on the influence of the thickness of the tray adhesives on the bonding strength between the trays and the elastomeric impression materials. Purpose: In order to understand the relationship between the thickness of the tray adhesive and the tensile bond strength and to suggest the thickness at which the bonding strength is strongest, tensile bond strength related to the thickness of adhesives of 3 different elastomeric impression materials were tested. Materials and methods: 3 impression materials, Permlastic^{®}. Regular Set(Kerr Corp., Romulus, Michigan, U.S.A.), Impregum^{TM} Penta^{TM}(3M ESPE, Seefeld, Germany), and Aquasil Ultra Monophase Regular Set Smart Wetting.(Dentsply Caulk, Milford, Delaware, U.S.A.), were used in this study, and tray adhesives from the same manufacturers of the impression materials were used, which were Rubber Base Adhesive, Polyether Adhesive, and Silfix, respectively. The tray specimens were prepared by autopolymerizing the tray material(Instant Tray Mix, Lang, Wheeling, Illinois, U.S.A.), and a PVC pipe was used to house the impression material. In group A, tray adhesives were applied in multiple thin layers of 1 to 5 and in group B, adhesives were applied only once, in the thickness equivalent to several applications. Lightness(L^*) of the adhesion surface was measured with a spectrophotometer(CM-3500d, Konica Minolta, Sakai, Osaka, Japan). The tensile bond strength of the elastomeric impression material and the tray resin was measured with universal materials testing machines(Instron, Model 3366, Instron Corp, Nowood, Massachusetts, U.S.A.). A formula between the number of adhesive application layers and the lightness of the adhesion surface was deduced in group A, and the number of adhesive layers in group B was estimated by applying the lightness(L^*) to the deduced formula. Results. 1. In group A, a statistically significant increase in tensile bond strength appeared when the number of application layers increased from 1 to 2 and from 4 to 5, and no significant difference was present between 2, 3, and 4 layers in Permlastic. In Impregum, the tensile bond strength was significantly increased when the number of adhesive layers increased from 1 to 3, but no significant difference after 3 layers. In Aquasil, the tensile bond strength significantly increased as the number of application layers increased up to 4 but showed no significant difference between 4 and 5. 2. In group B, the tensile bond strength was decreased when the thickness of the adhesive increased in Permlastic. Impregum showed an increased tensile bond strength when the thickness of the adhesive was increased. In Aquasil, the tensile bond strength increased as the number of adhesive application layers increased up to approximately 2.5 layers but it sharply decreased after approximately 4.5. Conclusion: From the study, the common idea that it is better to apply a thin and single coat of tray adhesive needs correction in more detailed ways, and instructions on some of the tray adhesives should be reconsidered since there were several cases in which the tensile bond strength increased according to the increase in the thickness of the adhesives.
Files in This Item:
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Appears in Collections:
2. College of Dentistry (치과대학) > Dept. of Prosthodontics (보철과학교실) > 1. Journal Papers
Yonsei Authors
Moon, Hong Seok(문홍석) ORCID logo https://orcid.org/0000-0001-8118-8145
Lee, Keun Woo(이근우) ORCID logo https://orcid.org/0000-0002-3153-190X
Chung, Moon Kyu(정문규)
URI
https://ir.ymlib.yonsei.ac.kr/handle/22282913/110368
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